AMD secures new glass substrate patent as race for the chipmaking technology intensifies
Glass substrates are ultra-thin, flat, transparent sheets made of high-purity silica or borosilicate glass. They serve as a base for semiconductor devices, enabling advanced packaging and ...
Semiconductor Engineering4d
Top-Down Vs. Bottom-Up Chiplet Design
Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.
AMD Ryzen 9 9950X3D and 9900X3D are coming, but with a catch, says leak
We reporteldy won't have to wait long for new 12-core and 16-core gaming CPUs with 3D V-cache, but the rumored specs look ...
Lowyat.net5d
AMD Ryzen 7 9800X3D Review: Pushing The 3D V-Cache Agenda Further
As many of you probably know, AMD's Ryzen 7 9800X3D CPU has landed. Like all it's predecessors, it holds the promise of ...